OVERVIEW

MSquare's ML100 IO Die is a high-bandwidth memory solution that integrates efficient UCIe (Die-to-Die) interconnect IP and HBM3 IP. The UCIe IP follows the UCIe 1.1 Specification and supports both standard and advanced packaging technologies, offering up to 1 TB/s of transfer bandwidth in a single module configuration. The UCIe supports the AXI4.0 interface standard, enabling ultra-low latency, high-speed interconnectivity between two dies. And the integrated HBM3 IP adheres to the HBM3 JESD238 standard and supports IO transfer rates of up to 6400 Mbps.

HIGHLIGHTS

Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard

Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard

Supports interconnectivity with the SoC via the AMBA AXI4.0 standard

The AXI4.0 bus supports bandwidth traffic and latency statistics

Supports various peripherals, i.e., NOR Flash, QSPI, I2C and UART

Maximum bandwidth is 819.2 GB/s, matching the bandwidth of 6400 Mbps HBM3 DRAM

Utilizes a 2.5D packaging solution, interconnected with the SoC through substrate

Decouples the HBM from the SOC, reducing the thermal effect on HBM DRAM